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Intel Xeon E5 2690 V3 E5-2690V3 2.6 GHz Used Twelve-Core Twenty-four-Thread 30MB 135W CPU LGA 2011
Intel Xeon E5 2690 V3 E5-2690V3 2.6 GHz Used Twelve-Core Twenty-four-Thread 30MB 135W CPU LGA 2011
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SPECIFICATIONS
Application: Server
Brand Name: Intel
Chip Process: 22 Nanometers
Choice: yes
Cooling system: No
Default TDP / TDP: 135
GPU-built: No
High-concerned chemical: None
Intel Model: Intel Xeon E5-2690V3
L2 Cache Capacity: 3MB
L3 Cache Capacity: 30MB
Number OF Therads: 24
Number of Cores: Twelve Cores
Origin: MY(Origin)
PCIe VERSION: PCIe 2.0
Package: No
Processor Type: Intel Xeon
Socket Type: LGA 2011-V3
Support Chipset Models: Intel Others
Support Memory Channels: 2
Support Memory Type: DDR4
Type: Twelve-Core
Unlocked: Yes
Usage Scenario: others
Intel Xeon E5-2690 v3 is a server processor in the Intel Xeon E5 v3 series, manufactured using 22nm technology. Its detailed parameters are as follows:
Core parameters: It has 12 cores and 24 threads, with a basic processor frequency of 2.60GHz and a maximum turbo frequency of 3.50GHz. It is equipped with 30MB Intel Smart Cache, a bus speed of 9.6GT/s, and 2 QPI links.
Power consumption: The thermal design power consumption (TDP) is 135W.
Memory specifications: The maximum supported memory size is 768GB, the memory type is DDR4 1600/1866/2133, the maximum number of memory channels is 4, the maximum memory bandwidth is 68GB/s, and ECC memory is supported.
Expansion options: Scalability is 2S, PCI Express revision 3.0, PCI Express configuration is x4, x8, x16, and the maximum number of PCI Express channels is 40.
Advanced Technology: Supports Intel Turbo Boost 2.0, Hyper Threading Technology, Intel AES New Instructions, Temperature Monitoring Technology, Virtualization Technology (VT-x, VT-d), etc.
Intel Xeon E5-2690 v3 specifications
General information | |
Type |
|
Market segment |
Server |
Family |
|
|
|
CPU part numbers |
|
Frequency ? |
2600 MHz |
Maximum turbo frequency |
3500 MHz |
Bus speed ? |
9.6 GT/s QPI (4800 MHz) |
Clock multiplier ? |
26 |
Package |
2011-land Flip-Chip Land Grid Array |
Socket |
Socket 2011-3 / R3 / LGA2011-3 |
Size |
2.07" x 1.77" / 5.25cm x 4.5cm |
Introduction date |
September 8, 2014 |
Price at introduction |
|
S-spec numbers | |
Architecture / Microarchitecture | |
Microarchitecture |
Haswell |
Platform |
Grantley-EP |
|
Haswell-EP |
|
M0 (QFRX) |
CPUID |
306F2 (SR1XN) |
Manufacturing process |
0.022 micron |
Data width |
64 bit |
The number of CPU cores |
12 |
The number of threads |
24 |
Floating Point Unit |
Integrated |
|
12 x 32 KB 8-way set associative instruction caches |
Level 2 cache size ? |
12 x 256 KB 8-way set associative caches |
Level 3 cache size |
30 MB 20-way set associative shared cache |
Physical memory |
768 GB |
Multiprocessing |
Up to 2 processors |
Extensions and Technologies |
|
Low power features |
|
Integrated peripherals / components | |
Integrated graphics |
None |
Memory controller |
The number of controllers: 2 |
Other peripherals |
|
Electrical / Thermal parameters | |
|
0.65V - 1.3V |
|
89.9°C |
Minimum power dissipation |
38 Watt (C1E state) |
Thermal Design Power ? |
135 Watt |
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