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Intel Xeon E3 1230 V2 E3 1230V2 Used 3.3 GHz 8M 69W CPU Processor LGA 1155

Intel Xeon E3 1230 V2 E3 1230V2 Used 3.3 GHz 8M 69W CPU Processor LGA 1155

CFA10,802 XOF
CFA0 XOF CFA10,802 XOF
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SPECIFICATIONS

Application: Desktop

Brand Name: Intel

Chip Process: 22 Nanometers

Choice: yes

Cooling system: No

Default TDP / TDP: 69

GPU-built: No

High-concerned chemical: None

Intel Model: 1230V2

L2 Cache Capacity: 1 MB

L3 Cache Capacity: 8 MB

Launch Date: 2004

Number OF Therads: 8

Number of Cores: Quad-Core

Origin: MY(Origin)

PCIe VERSION: PCIe 2.0

Package: No

Processor Type: Intel Xeon

Socket Type: LGA 1155

Support Chipset Models: Intel B75

Support Memory Channels: 2

Support Memory Type: DDR3

Type: Quad-Core

Unlocked: Yes

Usage Scenario: others

Intel Xeon E3-1230 V2 is a server level processor belonging to the Xeon E3 v2 series. Here are its detailed parameters:
Parameter details
Processor number E3-1230 V2
Photolithography at 22nm
Number of kernels 4
Bus number 8
Processor basic frequency 3.30GHz
Maximum turbo frequency 3.70GHz
Cache 8MB Intel Smart Cache
Bus speed 5GT/s
TDP 69W
Memory type DDR3 1333/1600
Maximum number of memory channels 2
Maximum memory bandwidth 25.6GB/s
What is the supported ECC memory
PCI Express Revision 3.0
Supported slots FCLGA1155
Maximum CPU configuration 1
Intel Turbo Boost Technology 2.0
Intel Hyper Threading Technology is
Intel ® Transactional Synchronization Extensions - New Instructions (Intel) ® TSX-NI) No
Intel ® 64 is
Instruction set 64 bit
Instruction Set Extension Intel ® SSE4.1，Intel ® SSE4.2，Intel ® AVX
Intel ® Virtualization technology (VT-x) is
Intel ® Virtualization Technology for Directed I/O (VT-d) is
Intel ® VT-x with Extended Page Tables (EPT) is

Intel Xeon E3-1230 v2 specifications



General information

Type

CPU / Micro

Market segment

Server

Family

Intel Xeon E3-1200 v2

Model number?

E3-1230 v2

CPU part numbers

  • CM8063701098101is an OEM/tray micro

  • BX80637E31230V2is a boxed micro

Frequency?

3300 MHz

Maximum turbo frequency

3700 MHz (1 or 2 cores)
3600 MHz (3 cores)
3500 MHz (4 cores)

Bus speed?

5 GT/s DMI

Clock multiplier?

33

Package

1155-land Flip-Chip Land Grid Array (FCLGA 1155)

Socket

Socket 1155 / H2 / LGA1155

Size

1.48" x 1.48" / 3.75cm x 3.75cm

Introduction date

May 14, 2012

End-of-Life date

Last order date is January 23, 2015
Last shipment date for tray is January 8, 2016
Last shipment date for boxed is July 10, 2015



S-spec numbers

Part number

ES/QS s

Production rs


QBZD

SR0P4

BX80637E31230V2


+

CM8063701098101

+

+

Architecture / Microarchitecture

Microarchitecture

Ivy Bridge

Platform

Carlow

core?

Ivy Bridge-H2

Core stepping?

E1 (QBZD, SR0P4)

CPUID

306A9 (SR0P4)

Manufacturing process

0.022 micron High-K metal gate process

Data width

64 bit

The number of CPU cores

4

The number of threads

8

Floating Point Unit

Integrated

Level 1 cache size?

4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches

Level 2 cache size?

4 x 256 KB 8-way set associative caches

Level 3 cache size

8 MB 16-way set associative shared cache

Physical memory

32 GB

Multiprocessing

Uni

Features

  • MMX instructions

  • SSE / Streaming SIMD Extensions

  • SSE2 / Streaming SIMD Extensions 2

  • SSE3 / Streaming SIMD Extensions 3

  • SSSE3 / Supplemental Streaming SIMD Extensions 3

  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4?

  • AES / Advanced Encryption Standard instructions

  • AVX / Advanced Vector Extensions

  • F16C / 16-bit Floating-Point conversion instructions

  • EM64T / Extended Memory 64 technology / Intel 64?

  • NX / XD / Execute disable bit?

  • VT-x / Virtualization technology?

  • VT-d / Virtualization for directed I/O

  • TBT 2.0 / Turbo Boost technology 2.0?

  • TXT / Trusted Execution technology

  • HT / Hyper-Threading technology?

Low power features

Enhanced SpeedStep technology?

Integrated peripherals / components

Integrated graphics

None

Memory controller

The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1333, DDR3-1600
Maximum memory bandwidth (GB/s): 25.6
ECC supported: Yes

Other peripherals

  • Direct Media Interface 2.0

  • PCI Express 3.0 interface

Electrical / Thermal parameters

Maximum operating temperature?

65.8°C

Thermal Design Power?

69 Watt

 



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